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AKASA AK-T505-5G T5 Essential Thermal Compound Syringe, 5g, Grey, Low Thermal Resistance, Non-Curing, Non-Electrically Conductive, Includes Spreader & Cleaning Wipes
  • Model: AK-T505-5G
  • In Stock:  65

AKASA AK-T505-5G T5 Essential Thermal Compound Syringe, 5g, Grey, Low Thermal Resistance, Non-Curing, Non-Electrically Conductive, Includes Spreader & Cleaning Wipes

£6.91
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We aim to same-day ship all orders placed before 4:00 PM,
Monday to Friday with RM 24® Tracked as standard.
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T5 EssentialEasily apply hi-performance thermal paste to your CPU and GPU, developed for higher thermal conductivity. Perfect for standard systems with 10-20 applications.- Low thermal resistance for hi-heat transfer- Non-curing and non-electrically conductive properties- Conveniently included...
Add to Cart:
  • Shipping Weight: 0.02 kgs
  • Manufactured by: Akasa
  • This product was added to our catalog on Friday 14 November, 2025.
  • ONLINE ONLY : This item is shipped direct from our suppliers warehouse, please allow 1-2 working days for delivery
  • GTIN : 4710679550824
Description
T5 Essential
Easily apply hi-performance thermal paste to your CPU and GPU, developed for higher thermal conductivity. Perfect for standard systems with 10-20 applications.
- Low thermal resistance for hi-heat transfer
- Non-curing and non-electrically conductive properties
- Conveniently included wipes and spreader

Low Thermal Resistance for Hi-Heat Transfer
Heat can easily be transferred from CPU or GPU to heatsink due to its low thermal resistance for efficient performance. Getting the most out of your CPU and air/liquid heatsink cooler.

Easy and Safe Application
Non-curing paste means no time required to wait for curing process reaching its highest performance right from the get-go. Non-conductive properties ensures that there is no electrical risk with components.

Conveniently Included Wipes and Spreader
Easy application with included spreader to get an even coating on CPU or GPU for best efficiency. Wipes also included to clean old
paste to make sure a good bond is established with heatsink.

Application
Thermally conductive compound

Thermal Conductivity
4.0 W/mK

Specific Gravity
2.6

Form
Non-curing compound

Operating Temperature
-50°C to 220°C

Thermal Resistance
0.07°C-cm²/W @ 60 psi

Colour
Grey

Viscosity
4,800,000 (mPa.s/ 22°C)

Weight
5g
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